1.1 This specification provides the means to measure and evaluate the performance of adhesives for structural or semi-structural bonding of wood-to-wood in manufactured homes. Wood as used in this specification includes lumber, plywood, particleboard, gypsum board, and all materials having wood-based surfaces at the bondline. This specification does not cover other adhesives used in manufactured homes such as adhesives for carpet, floor tile, ceramic fixtures, plastic laminates, trim and millwork, and similar nonstructural applications.
1.1.1 The performance of the adhesives is measured in the following tests:
|
Number |
Test |
Section |
|
1 |
Low Temperature |
16 |
|
2 |
Dry Lumber |
17 |
|
3 |
Gap-Filling |
18 |
|
4 |
High Temperature |
19 |
|
5 |
Type 3 Qualification |
20 |
|
6 |
Type 2 Qualification |
21 |
|
7 |
Aging, Film Oxidation |
22 |
|
8 |
Aging, Bond Oxidation |
23 |
|
9 |
Resistance to Deformation, Creep |
24 |
|
10 |
Mold |
25 |
|
11 |
Type 1 Qualification |
26 |
Product Details
- Published:
- 04/01/2015
- Number of Pages:
- 18
- File Size:
- 1 file , 280 KB
