1.1 This specification covers low-melting point metal alloys and solders, including bismuth-tin, bismuth-lead, bismuth-tin-lead, bismuth-tin-lead-cadmium, bismuth-tin-lead-indium-cadmium, bismuth-tin-lead-indium, indium-lead, and indium-lead-silver, and indium-tin joining together two or more metals at temperatures below their melting points; blocking for support and removable borders; radiation shielding; fusible plugs; fuses; tube bending; and punch setting.
1.1.1 This specification shall include those alloys having a liquidus temperature not exceeding 361°F (183°C), the melting point of the tin lead eutectic.
Product Details
- Published:
- 10/01/2014
- Number of Pages:
- 4
- File Size:
- 1 file , 73 KB
