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This specification covers a two-component compound, an epoxy resin base and a hardener, in the form of a paste.This adhesive compound has been used typically for non-structural bonding of metallic alloys and thermosetting plastics to themselves and to each other; it is intended primarily as an adhesive for electrical components nd devices operating at not higher than 185 \mDF (85 \mDC), but usage is not limited to such applications.
Product Details
- Published:
- 07/20/2009
- File Size:
- 1 file , 82 KB
