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This specification covers the requirements for electrodeposition copper.This process has been used typically to provide an anti-seize surface, to prevent carburizing of surfaces on which carburizing is neither required nor permitted, to prevent decarburization, to enhance solderability, or to provide a source of copper for furnace brazing, but usage is not limited to such applications.
Product Details
- Published:
- 02/18/2011
- File Size:
- 1 file , 44 KB
