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This document provides an overview of the methodology necessary for making meaningful thermal measurements on high-power light-emitting diodes (LEDs) built on single or multiple chips with one or more pn-junctions per chip. The actual methodology components are contained in separate detailed documents.
Product Details
- Published:
- 04/18/2012
- Number of Pages:
- 12
- File Size:
- 1 file , 73 KB
