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This specification details the procedures for the measurement of characteristic bulk material properties of moisture diffusivity and water solubility in organic materials used in the packaging of IC components. These two material properties are important parameters for the effective reliability performance of plastic packaged ICs after exposure to moisture and subjected to high temperature solder reflow.
Product Details
- Published:
- 07/01/2014
- Number of Pages:
- 16
- File Size:
- 1 file , 150 KB
- Redline File Size:
- 2 files , 4.2 MB
