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This publication provides an overview of solder void types, outlines current metrologies and test methods used for pre-SMPT solder void characterization and potential limitations, and prescribes sampling strategy for data collection, and tolerance guidelines for corrective measures.
Product Details
- Published:
- 09/01/2010
- Number of Pages:
- 44
- File Size:
- 1 file , 1.8 MB
