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Chemical safety and emergency response demand the 2015 NFPA 318: Standard for the Protection of Semiconductor Fabrication Facilities.

The semiconductor industry is continually growing, requiring new safeguards to address evolving hazards. Completely reorganized and up-to-date with the latest coverage of technologies such as photovoltaics, NFPA 318: Standard for the Protection of Semiconductor Fabrication Facilities applies to semiconductor fabrication facilities and comparable R&D areas in which hazardous chemicals are used, stored, and handled — containing a cleanroom or clean zone or both.

Chapters address every aspect of safety, from general safety precautions and fire protection to construction, chemical storage and handling, hazardous gas cylinder storage and distribution, bulk silane systems, production and support equipment, emergency control station, and means of egress. This edition adds display panel and photovoltaic production to its scope, along with other major changes.

The 2015 NFPA 318 assists all stakeholders involved in fire protection: engineers, AHJs, facility personnel, and contractors.

This rewritten, clarified edition provides new definitions, identification of hazardous materials categories, and an introduction to Hazard Production Material (HPM) risk assessment. It also adds numerous new requirements addressing:

  • Hazardous materials
  • Liquid chemical storage and handling
  • Gas storage and handling
  • Production and support equipment
  • Waste treatment
  • Fire protection

Product Details

Published:
05/19/2014
ISBN(s):
9781455909063
ANSI:
ANSI Approved
Number of Pages:
43

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Safeguard people and property in semiconductor plants and research facilities with the 2012 NFPA 318.

Up-to-date with the latest references to NFPA® codes and other documents, NFPA 318: Standard for the Protection of Semiconductor Fabrication Facilities applies to semiconductor fabrication facilities and comparable R&D areas in which hazardous chemicals are used, stored, and handled — containing a cleanroom or clean zone or both.
Chapters cover core topics including:

  • Fire protection
  • Ventilation and exhaust systems
  • Construction
  • Chemical storage and handling
  • Hazardous gas cylinder storage and distribution
  • Bulk silane systems
  • Production and support equipment
  • Emergency control station
  • General safety precautions
  • Means of egress

Three annexes provide helpful explanatory material; additional facts about seismic protection, and production and support equipment; and informational references. Facility engineers, owners, and managers, plant safety directors, safety trainers, risk insurers, and AHJs need the latest requirements for semiconductor fabrication facilities based on industry needs, new technology, and recent experience.

Product Details

Published:
06/20/2011
ISBN(s):
9781455901074
ANSI:
ANSI Approved
Number of Pages:
36

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Improve chemical safety and emergency response using the 2018 edition of NFPA 318: Standard for the Protection of Semiconductor Fabrication Facilities.

The semiconductor industry continues to advance, requiring new safeguards to address evolving hazards. Reorganized and with major revisions to the requirements for both gas-detection systems as well as smoke detection systems, NFPA 318: Standard for the Protection of Semiconductor Fabrication Facilities applies to semiconductor fabrication facilities and comparable R&D areas in which hazardous chemicals are used, stored, and handled — containing a cleanroom or clean zone or both.

Chapters address every aspect of safety, from general safety precautions and fire protection to construction, chemical storage and handling, hazardous gas cylinder storage and distribution, bulk silane systems, production and support equipment, emergency control station, and means of egress.

The 2018 edition of NFPA 318 assists all stakeholders involved in fire protection: engineers, AHJs, facility personnel, and contractors.

  • Requirements for gas-detection systems as well as smoke detection systems are technically modified and also revised for clarity.
  • Gas detection criteria are revised to clarify when detection is needed and where it is required to be physically provided.
  • Requirements for detection are revised to include not just minimum capabilities of detectors but also coverage areas, alert and alarm sensitivities, and maximum transport times taken from NFPA 76: Standard for the Fire Protection of Telecommunications Facilities, which were based on research conducted by the Fire Protection Research Foundation.

Product Details

Published:
08/21/2017
ISBN(s):
9781455916931
ANSI:
ANSI Approved
Number of Pages:
44

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Today’s NFPA 318 safeguards people and property in plants and research facilities.

NFPA 318: Standard for the Protection of Semiconductor Fabrication Facilities applies to semiconductor fabrication facilities and comparable R&D areas in which hazardous chemicals are used, stored, and handled–containing a cleanroom or clean zone or both. For the 2009 edition, the document’s scope was revised to apply to semiconductor fabrication facilities and areas with comparable fabrication processes and risks.

Major technical changes for 2009 include:

  • First-time requirements for Sub Atomic Gas (SAG) Systems
  • New requirements involving exhaust ducts
  • Maximum hazardous chemical quantities at a workstation limited to 3 cylinders to reduce change-out frequency
  • Revisions to safety considerations for chemical storage and handling, hazardous gas cylinder storage and distribution, bulk silane systems, and production and support equipment

Facility owners and managers, plant safety directors, safety trainers, risk insurers, and AHJs need the latest requirements based on industry needs, new technology, and recent experience.

Product Details

Published:
11/07/2008
Number of Pages:
28

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