This paper presents an overview of a method of calculating the load imparted by datacom equipment to the raised floor and building subfloor structure. In addition, this paper discusses the tie-down of datacom equipment with the intention of withstanding a severe earthquake test profile. The development of the frame structure and related tie-down hardware involves extensive earthquake simulation testing in both raised-floor and non-raised-floor environments. The focus of this paper is on high-performance computers and servers weighing more than 10,000N.
Units: SI
Citation: Symposium, ASHRAE Transactions, vol. 112, pt. 1
Product Details
- Published:
- 2006
- Number of Pages:
- 7
- File Size:
- 1 file , 2.4 MB
- Product Code(s):
- D-27945
