1.1 These test methods cover photometric procedures for the chemical analysis of copper and copper alloys having chemical compositions within the following limits:
Copper, % 50 and over Tin, % 0.0 to 20 Lead, % 0.0 to 27 Iron, % 0.0 to 4 Manganese, % 0.0 to 6 Silicon, % 0.0 to 5 Aluminum, % 0.0 to 12 Nickel, % 0.0 to 5 Sulfur, % 0.0 to 0.1 Phosphorus, % 0.0 to 1.0 Arsenic, % 0.0 to 1.0 Antimony, % 0.0 to 1.0 Zinc remainder
1.2 The analytical procedures appear in the following order:
Antimony by the Iodoantimonite (Photometric) Test Method 70 to 79 Arsenic in Fire-Refined Copper by the Molybdate Test Method 60 to 69 Iron by the Thiocyanate Test Method 1a Manganese by the Periodate Test Method 41 to 48 Nickel by the Dimethylglyoxime-Extraction Photometric Test Method 1a Phosphorus by the Molybdivanadophosphoric Acid Method: Deoxidized Copper and Phosphorized Brasses 17 to 24 Copper-Base Alloys Containing 0.01 to 1.2% Phosphorus 25 to 33 Tin by the Phenylfluorone Photometric Test Method 80 to 90 Silicon by the Molybdisilicic Acid Test Method 49 to 59
1.3 This standard does not purport to address all of the safety problems, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. For precautions to be observed in the use of certain reagents, refer to Practices E50.
Product Details
- Published:
- 01/01/1996
- Number of Pages:
- 9
- File Size:
- 1 file , 81 KB
