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1.1”This specification covers low-melting point metal alloys and solders, including bismuth-tin, bismuth-lead, bismuth-tin-lead, bismuth-tin-lead-cadmium, bismuth-tin-lead-indium-cadmium, bismuth-tin-lead-indium, indium-lead, and indium-lead-silver, and indium-tin joining together two or more metals at temperatures below their melting points; blocking for support and removable borders; radiation shielding; fusible plugs; fuses; tube bending; and punch setting.

1.1.1”This specification shall include those alloys having a liquidus temperature not exceeding 361””’F [183””’C], the melting point of the tin lead eutectic.

Product Details

Published:
04/01/2021
Number of Pages:
4
File Size:
1 file , 76 KB
Redline File Size:
2 files , 150 KB