1.1 These test methods cover procedures for testing adhesives in liquid, highly viscous, solid, or set states, that are intended to be cured by electronic heating, or that are intended to provide electrical insulation, or that are intended for use in electrical apparatus.
1.2 The procedures appear in the following order: (1) Procedure for Testing Adhesives Before Use:
Section Power Factor and Dielectric Constant of Liquid Adhesives 7 Direct-Current Conductivity 8 Extract Conductivity 9 Acidity and Alkalinity 10 pH Value 11 Section Power Factor and Dielectric Constant of a Dried or Cured Adhesive Film 12 Dielectric Strength 13 Volume and Surface Resistivity 14 Arc Resistance 15
1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use . For a specific hazard statement, see 8.2.
Product Details
- Published:
- 05/10/1999
- Number of Pages:
- 4
- File Size:
- 1 file , 65 KB
