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1.1 This test method covers the determination of the volume resistivity of resin-based conductive adhesives in the cured condition. The test is made on a thin adhesive layer as prepared in a bonded specimen. This test method is used for conductive adhesives that are cured either at room temperature or at elevated temperatures.

Product Details

Published:
11/01/2017
Number of Pages:
3
File Size:
1 file , 93 KB