1.1 This test method describes a method of measuring the shear modulus and rupture stress in shear of adhesives in bonded joints. The method employs lap-shear specimens with wood, metal, or composite adherends, with adhesives having shear moduli ranging up to 700 MPa (100000 psi). This test method is suitable generally for joints in which the ratio of adherend tensile modulus to adhesive shear modulus is greater than 300 to 1. It is not suitable for adhesives that have a high shear modulus in the cured state and that also require elimination of volatile constituents during cure.
1.2 This standard does not purport to address all of the safety problems, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
Product Details
- Published:
- 03/10/1998
- Number of Pages:
- 11
- File Size:
- 1 file , 170 KB
