1.1 This test method describes a method of measuring the shear modulus and rupture stress in shear of adhesives in bonded joints. The method employs lap-shear specimens with wood, metal, or composite adherends, with adhesives having shear moduli ranging up to 700 MPa (100 000 psi). This test method is suitable generally for joints in which the ratio of adherend tensile modulus to adhesive shear modulus is greater than 300 to 1. It is not suitable for adhesives that have a high shear modulus in the cured state and that also require elimination of volatile constituents during cure.
Product Details
- Published:
- 03/01/2019
- Number of Pages:
- 11
- File Size:
- 1 file , 370 KB
