1.1 This test method covers the use of dynamic-mechanical-oscillation instrumentation for gathering and reporting the thermal advancement of cure behavior of thermosetting resin. It may be used for determining the cure properties of both unsupported resins and resins supported on substrates subjected to various oscillatory deformations.
Product Details
- Published:
- 11/01/2016
- Number of Pages:
- 5
- File Size:
- 1 file , 150 KB
