1.1 The specification covers a two-part modified epoxy paste adhesive for bonding metallic and nonmetallic materials. The adhesive should be suitable for forming bonds that can withstand environmental exposure to temperatures from -184 to 82 °C (-300 to 180°F) when exposed to an expected combination of stress, temperature, and relative humidity to be encountered in service.
Note 1 – When coordinated through the Department of Defense (DoD) and the National Aeronautics and Space Administration (NASA), this practice will be a direct replacement of MIL-A-82720 (OS), MIS-26872, and MSFC-SPEC-2037.
Product Details
- Published:
- 10/01/2012
- Number of Pages:
- 4
- File Size:
- 1 file , 78 KB
