1.1 This specification is designed to evaluate adhesives suitable for the bonding of oriented strand board (OSB) to rigid cellular polystyrene insulation core materials for general structure use.
1.2 The requirements of the structural insulated panel (SIP) adhesive are based on the performance of the adhesive as measured by:
1.2.1 Resistance to shear by compression loading in ambient conditions and after accelerated aging.
1.2.2 Resistance to tensile loading in ambient conditions and after accelerated aging.
1.2.3 Resistance to creep (deformation) under static load in ambient conditions and after accelerated aging.
1.2.4 Tensile and shear strength to polystyrene core materials.
1.3 The classification of the adhesive formulation is based on, but not limited to the adhesive's industry accepted generic names, for example: phenol-resorcinol, emulsion polymer isocyanate, one and two-part urethane. The type of adhesive application and curing terminology are also usually included for classification purposes such as cold-setting phenol resorcinol, heat-cured phenol resorcinol, and hot melt one component urethane.
1.4 Evaluation of adhesive performance at high temperature conditions, such as during a fire exposure, is beyond the scope of this specification.
1.5 The values stated in SI units are to be regarded as the standard. The values given in parentheses are for information only.
1.6 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
Product Details
- Published:
- 09/01/2009
- Number of Pages:
- 8
- File Size:
- 1 file , 190 KB
