1.1 This specification covers the requirements for an epoxy resin system intended for the repair of sandwich panels for durable, rigidwall, relocatable structures. It must be usable in a field environment and shall not require the use of special equipment such as autoclaves or presses. The epoxy system covered by this specification shall be usable for simultaneous impregnation of a wet-layup composite skin and bonding of that skin to a substrate honeycomb core. The material shall withstand exposure to temperatures from −54 °C to 93 °C (−65 °F to 199 °F) and high relative humidity, and also the combination of stress, temperature, and relative humidity that are expected to be encountered in service.
Product Details
- Published:
- 09/01/2020
- Number of Pages:
- 9
- File Size:
- 1 file , 240 KB
- Redline File Size:
- 2 files , 520 KB
