1.1 This test method covers a procedure for measuring the compressive residual strain in thin films. It applies only to films, such as found in microelectromechanical systems (MEMS) materials, which can be imaged using an optical interferometer, also called an interferometric microscope. Measurements from fixed-fixed beams that are touching the underlying layer are not accepted.
Product Details
- Published:
- 05/01/2018
- Number of Pages:
- 25
- File Size:
- 1 file , 730 KB