1.1 This practice relates to the radiographic examination of electronic devices for internal discontinuities, extraneous material, missing components, crimped or broken wires, and defective solder joints in cavities, in the encapsulating materials, or the boards. Requirements expressed in this practice are intended to control the quality and repeatability of the radiographic images and are not intended for controlling the acceptability or quality of the electronic devices imaged.
Note 1: Refer to the following publications for pertinent information on methodology and safety and protection: Guides E94 and E1000, and “General Safety Standard for Installation Using Non-Medical X Ray and Sealed Gamma Ray Sources, Energies Up to 10 MeV Equipment Design and Use,” Handbook No. 114.2
Product Details
- Published:
- 12/01/2016
- Number of Pages:
- 4
- File Size:
- 1 file , 120 KB
- Redline File Size:
- 2 files , 250 KB
