1.1 This test method covers the determination of the shear integrity of materials and procedures used to attach surface mount devices (SMD) to a membrane switch circuit.
1.2 This test method is typically used to indicate the sufficient cure of conductive adhesive or underfill, or both. In general, this test method should be used prior to encapsulant. This test may also be used to demonstrate the Shear Force with encapsulation.
1.3 The values stated in SI units are to be regarded as standard. No other units of measurement are included in this standard.
1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
Product Details
- Published:
- 02/01/2012
- Number of Pages:
- 2
- File Size:
- 1 file , 66 KB
- Redline File Size:
- 2 files , 130 KB
