1.1 This test method covers the determination of the adhesion strength of films to substrates by pulling wires soldered to the films.
1.2 This test method is intended to measure the adhesion of metallization to substrates, and not the strength of the solder.
1.3 This test method applies to all films that can be soldered.
1.4 The maximum melting point of solder used with this test method is determined by the characteristics of the solder flux.
1.5 This test method is destructive.
1.6 This standard does not purport to address the safety concerns, if any, associated with its use. It is the responsibility of whoever uses this standard to consult and establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
Product Details
- Published:
- 12/10/2002
- Number of Pages:
- 7
- File Size:
- 1 file , 210 KB
