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Published annually in April.

This volume contains 150 standards.

Subjects cover:

  • Innerlayer Interconnections and Bonding
  • Materials and Processes for Vacuum Tubes
  • Electronic Device Characterization
  • Hermetic Seals
  • Hybrid Circuits and Substrates
  • Microelectronic Packaging
  • Leak Testing
  • and more
    This volume also includes the latest standards relating to

  • Declarable substances in materials
  • 3D imaging systems
  • Additive manufacturing technologies

Product Details

Published:
04/01/2020
ISBN(s):
9781682216682
Number of Pages:
1192