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This volume opens with a sweeping overview of the physical design of electronic systems-methodology, technology, and future challenges-thermally induced failures in electronic systems. Subsequent chapters examine the causes for thermally induced failures of electronic components and the techniques used to analyze and prevent such failures. It gives a comprehensive bibliograhy of project managers and lead engineers, packaging engineers and mechanical analysts, consultants, and academic, industrial, and government laboratory researchers.
Product Details
- Published:
- 01/01/1993
- ISBN(s):
- 0791800180
- Number of Pages:
- 450
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
