Click here to purchase
This standard establishes the general requirements and quality assurance provisions that can be specified and met in procuring microelectronics packages and covers, manufactured from matched seal with and without high thermal conductivity base materials, intended for use in fabricating hybrid microelectronics circuits. This document details those minimum requirements necessary for metal packages’ use exclusively.
Product Details
- Published:
- 04/01/1987
- Number of Pages:
- 55
- File Size:
- 1 file , 810 KB
