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This standard provides a method for determining solid state devices capability to withstand extreme temperature cycling. Changes in this revision include requirements that the worst-case load temperature must reach the specific extremes rather than just requiring that the chamber ambient temperature reach the extremes. This ensures that the test specimens will reach the specified temperature extremes regardless of chamber loading. Definitions are provided for Load, Monitoring Sensor, Worst-Case Load Temperature, and Working Zone. The transfer time has been tightened from 5 minutes to 1 minute. Five new test conditions have been added as well as a caution on test conditions which exceed the glass transition temperature of plastic package solid devices.
Product Details
- Published:
- 03/01/2009
- Number of Pages:
- 18
- File Size:
- 1 file , 160 KB
