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The Flip Chip Tensile Pull Test Method is performed to determine the fracture mode and strength of the solder bump interconnection between the flip chip die and the substrate. It should be used to assess the consistency of the chip join process. This test method is a destructive test,
Product Details
- Published:
- 01/01/2009
- Number of Pages:
- 16
- File Size:
- 1 file , 67 KB
