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This fixturing further defines the environment for thermal test of packaged microelectronic devices. Its function is to provide an alternate mounting surface for the analysis of heat flow in electronic components. The objective of the standard is to provide a high effective thermal conductivity mounting surface that can be compared equally against standard tests done in different laboratories with typical variations of less than or equal to 10%.
Product Details
- Published:
- 02/01/1999
- Number of Pages:
- 12
- File Size:
- 1 file , 310 KB
