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This publication specifies a common method of establishing the fracture resistance of board-level device interconnects to flexural loading during non-cyclic board assembly and test operations. Monotonic bend test qualification pass/fail requirements are typically specific to each device application and are outside the scope of this document.
Product Details
- Published:
- 06/01/2004
- Number of Pages:
- 19
- File Size:
- 1 file , 230 KB
