Heat dissipation levels for components within a computer electronics rack are increasing to the point where traditional air-cooling needs will no longer meet thermal management requirements. Liquid cooling at the component and/or rack level is going to be the logical choice to replace air cooling. This paper will outline the requirements that will have to be met (i.e., temperature, pressure, cleanliness, quality) and the liquid cooling system architectures that will be needed to maintain the high availability associated with the computer systems being cooled. Additionally, alternative ways to deal with liquid cooling at the facilities level will be addressed.
Units: Dual
Citation: ASHRAE Transactions, vol. 113, pt. 2
Product Details
- Published:
- 2007
- Number of Pages:
- 8
- File Size:
- 1 file , 7.4 MB
- Product Code(s):
- D-LB-07-015
