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This specification covers the engineering requirements for preparing surfaces of polytetrafluoroethylene (PTFE) for bonding and the properties resulting from the treatment. This process has been used typically for rendering surfaces of parts capable of supporting a high strength adhesive bond. The bonding preparation can affect the electrical properties of the PTFE and this should be considered before using it for treatment of electronic components.
Product Details
- Published:
- 01/08/2015
- File Size:
- 1 file , 71 KB
- Redline File Size:
- 2 files , 2.8 MB
