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This specification covers epoxy-resin-impregnated glass laminates in the form of sheets clad on one or both sides with electrolytic copper foil. This product has been used typically in the fabrication of etched, printed circuits for electrical and electronic equipment where a combination of low moisture absorption, hot strength retention, and bond strength are required, but usage is not limited to such applications.
Product Details
- Published:
- 08/25/2011
- File Size:
- 1 file , 820 KB
