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This document describes the materials, equipment, and processing techniques utilized in the fabrication of polyamide printed wiring boards. Included are recommendations for both double-sided and multi-layer boards. The processes described herein are the result of extensive evaluation and manufacturing experience. These recommendations reflect procedures that have proven effective in producing low-cost and reliable printed wiring boards.
Product Details
- Published:
- 08/14/2014
- File Size:
- 1 file , 1 MB
